TECHNET Archives

September 1997

TechNet@IPC.ORG

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Subject:
From:
Aric J Parr <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Tue, 9 Sep 1997 13:15:08 -0500
Content-Type:
text/plain
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text/plain (12 lines)
WHY???????
        If parts are solderable prior to taping and properly packaged and
stored, solderability should be the same as other packaging schemes when parts
arrive at the customer.



______________________________ Reply Separator _________________________________
Subject: [TECHNET] ASSY: PARTS SOLDERABILITY
Author:  Jim Marsico 516-595-5879 <[log in to unmask]> at INTERNET


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