Hello,

I have a couple of questions concerning PGA at the wave soldering operation.

 - If I want to solder only the PGA (located in the centre of the board) and
avoid the rest of the board, what can I use to efficiently cover these areas
on the solder side (something that can be used in a production mode) ?

 - There are tiny SMT components located in the perimeter set by the inner
pins of the PGA, on the solder side. Am I the only one who experienced the
problem of having these small components falling into the solder bath even
though they were glued ?  Is mold seal the best solution ?

 - Is it possible that the heat needed to solder the PGA be too much for
these small components (1206, 0805, etc.) ?  If so, how do I protect them ?

As always, your advices will be quite helpful. Thank you.

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