Hi Technetters.
One of the largest flexible PCB shop in Korea tried to laminate PI coverlay
of one mil thick onto one mil/one ounce RA PI flexibles and floated them
on a solder pot at 300 degree C for ten second. All the test coupons
blistered. They claimed that Japanese coverlay withstands such condition,
and asked us to improve the thermal resistance of the coverlay. I would
like to be advised of your opinion on the test and its validity in real
field. In other word, what do you see out of the 300 C test? Could you
give me some light to lead persuade them into 288 C test ?
Thanks and regards
Myung C. Chu
CSS Asia Co., Ltd.
Tel: 82-2-523-8810
Fax: 82-2-523-1483
E-Mail: [log in to unmask]