TECHNET Archives

September 1997

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Mime-Version:
1.0
Content-Type:
text/plain; charset="US-ASCII"
Date:
Mon, 8 Sep 1997 15:21:26 -0500
Reply-To:
"TechNet Mail Forum." <[log in to unmask]>, Erik Olson <[log in to unmask]>
Subject:
From:
Erik Olson <[log in to unmask]>
Content-Transfer-Encoding:
quoted-printable
Organization:
Westell, Inc.
Sender:
TechNet Mail Forum<[log in to unmask]>
Parts/Attachments:
text/plain (9 lines)
Hi TechNetters,

I'm planning an experiment to test adhesive screen printing used to attach bottomside components to a PCB.  My first thought for how to test this is to measure the strength of the adhesive bond between the board and the components.  Is anyone out there familiar with the equipment and steps required to perform what I've heard referred to as a "pull test"?  And, are there any other variables/parameters that are useful to measure in a test of adhesive screen printing?

Erik Olson
Manufacturing Engineer
Westell, Inc.


ATOM RSS1 RSS2