TECHNET Archives

August 1997

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re[2]: [TECHNET] Gold / Silver Incompatibility for Adhesives
From:
MCHAN <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Thu, 7 Aug 1997 11:16:08 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (17 lines) 
     Hi,

      Can you elaborate on why you would use Ag filled epoxy in conjunction
     with PbSn solder??  As for using Ag filled epoxy on Au surfaces, isn't
     this technology main stream in die attach on MCM, COB applications
     where the die is electrically grounded to the die pad via Ag filled
     epoxy....We have not seen any reliability problems even on Mil type
     applications

     Marcelo


______________________________ Reply Separator _________________________________
Subject: Re: [TECHNET] Gold / Silver Incompatibility for Adhesives
Author:  "TechNet Mail Forum." <[log in to unmask]> at smtp

ATOM RSS1 RSS2