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August 1997

TechNet@IPC.ORG

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Subject:
From:
"Jay DeKing (EMA)" <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Fri, 1 Aug 1997 16:13:55 -0400
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How do you determine the optimum inner and outer diameters for the lands
and clearance areas for a padstack with thermal ties to the power or ground
plane? A semi-newbie colleague asked me this today and I had to admit I
didn't know. Every company I have done board layout for has their own
standards, and there is wide variation in the sizes used. The spoke width
for all, though, has been a consistent .015".

The colleague I spoke of also looked claimed to have looked through the IPC
specs, but found inconsistency there, as well.

Any ideas?

Jay DeKing


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