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August 1997

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Subject:
Re: FAB: IPC-6012 & Lifted Lands
From:
Lisa Williams <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Tue, 5 Aug 1997 16:43:06 -0500
Content-Type:
text/plain
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text/plain (40 lines) 
Thad,

Para 3.3.4 refers to visual inspection. If you can see it by visual inspection, the board should be rejected.

If the board has passed visual inspection for lifted lands, and during a thermal stress microsection you see lifted lands, the board is still good.

Lisa Williams
IPC

>>> Thad McMillan <[log in to unmask]> 08/05/97 02:01PM >>>
     I am confused at what the current IPC-6012 states regarding Lifted
     Lands:

     -------------------------

     Page 11:

     3.6.2.9 Lifted Lands  Lifted lands are allowed after thermal stress
     provided that the visual criteria of section 3.3.4 are met.


     Page 6:

     3.3.4 Lifted Lands The Finished board shall not exhibit any lifted
     lands

     -------------------------

     In the old IPC-RB-276 lifted lands was permitted after thermal stress.

     Is this an error in IPC-6012 or has there been a change in what is
     acceptable?

     I'd appreciate any feedback.

     Thanks,

     [log in to unmask]

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