TECHNET Archives

August 1997

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Thad McMillan <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Tue, 5 Aug 1997 14:01:00 CDT
Content-Type:
text/plain
Parts/Attachments:
text/plain (30 lines)
     I am confused at what the current IPC-6012 states regarding Lifted
     Lands:

     -------------------------

     Page 11:

     3.6.2.9 Lifted Lands  Lifted lands are allowed after thermal stress
     provided that the visual criteria of section 3.3.4 are met.


     Page 6:

     3.3.4 Lifted Lands The Finished board shall not exhibit any lifted
     lands

     -------------------------

     In the old IPC-RB-276 lifted lands was permitted after thermal stress.

     Is this an error in IPC-6012 or has there been a change in what is
     acceptable?

     I'd appreciate any feedback.

     Thanks,

     [log in to unmask]


ATOM RSS1 RSS2