Hi Technetters,
I am trying to introduce a new method for innerlayer preparation into  the manufacturing process. 
I am quite capable of determining the PCB's reliabilty through thermal shocks (solder float, HASL, reflow) and even through quantitative tests such as peel and shear test. 
But can you suggest me tests that can assure me that the boards will "live" for 15-20 years? 

Are there any standard methods for this kind of "ageing" that can present a correlation between the short-run test parameters and the long range life cycle of the product?

Any input will be appreciated.

Thanks and have a nice week,
Yehuda

    ************************************* 
    *          Yehuda E. Weisz              
    *  e-mail: [log in to unmask]
    *  Tel: 972-3-5240362                    
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