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August 1997

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Fri, 29 Aug 1997 18:05:16 -0400
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Hallo Ingemar,
Stree analyses and FE-modeling of solder joints has a long history of not
producing much practical information.  The reasons are that solder joint
loading is dominated by strains, not stresses, and the creep of the solder.
That makes stress analysis very complicated and requires assumptions of
constitutive behavior.
I will be giving a workshop "Practical Design and Prediction Methods for
Surface Mount Solder Joint Reliability" at ISHM-Nordic near Oslo on September
21, where your concerns are going to be addressed.

Werner Engelmaier
Engelmaier Associates, Inc.
Electronic Packaging, Interconnection and Reliability Consulting
23 Gunther Street
Mendham, NJ  07945  USA
Phone & Fax: 973-543-2747
E-mail: [log in to unmask]


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