TECHNET Archives

August 1997

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re: BGA Solder Ball Migration
From:
Viswanath Valluri <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Fri, 29 Aug 1997 10:59:11 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (20 lines) 
Hi :

There could be several reasons for this.  The maximum temperature  reached,
time above 183 C , handling of trays, any air flow in the reflow chamber.
All these contributed significantly to the "merging of solder balls".

Regards

Vis Valluri

---- TechNet(a)IPC.ORG's Message ----

Hi-
I was wondering what might cause solder balls to "merge" together during
reflow?

--
Dennis Fall

ATOM RSS1 RSS2