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August 1997

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Subject:
From:
Richard MacCutcheon <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Fri, 29 Aug 1997 10:34:00 -0600
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======== Original Message ========
I work in a material and failure analysis lab for Lockheed Martin.
        We have a set of PCBs that are failing after hand soldering
operations.
Similar hand soldering operations on other boards are successful. Cross
sections of the failed areas shows pad lifting and a seperation of the
barrel and innerconnection on layer 5. The board is a 6 layer glass
epoxy GFG board. Suspect problem with board material between layers 5 &
6.
        Looking for information on types of tests to run, printed material
relating to testing PCBs, or other sources for information.
        Thank You.

        Russ Salvo
======== Fwd by: Richard MacCu ========
Is there only one operator doing the soldering or many?

If there are many, check all iron temps and specifically check the operator
who incurred the failure.  I have experienced a case where one employee was
not following correct procedure even after seven years of service.

The other item to check is if there were mixed lots of laminate involved.
If so have the vendor of the laminate retest a sample for cure of the resin.


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