I work in a material and failure analysis lab for Lockheed Martin.
        We have a set of PCBs that are failing after hand soldering operations.
Similar hand soldering operations on other boards are successful. Cross
sections of the failed areas shows pad lifting and a seperation of the
barrel and innerconnection on layer 5. The board is a 6 layer glass
epoxy GFG board. Suspect problem with board material between layers 5 &
6.
        Looking for information on types of tests to run, printed material
relating to testing PCBs, or other sources for information.
        Thank You.

        Russ Salvo