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August 1997

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Subject:
Test Die and Substrate
From:
Larry Crane <[log in to unmask]>
Reply To:
[log in to unmask]
Date:
Fri, 29 Aug 1997 11:20:44 -0400
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TechNet-

My company is developing new underfill and encapsulant materials.  We have
a need for a reliable source of test chips with matching   FR-4 electrical
test vehicles.  Can anyone suggest a source?

Dr. Larry Crane
Manager, Electronics Product Development
Loctite Corporation
860-571-5497

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