I'm not sure if the work you are referring to is the same, but Dr. Hasan
Akey, in the Mechanical Engineering Department at the Indiana University,
Purdue University and Indianapolis (IUPUI) has done considerable work in
this area.  You might want to drop him a line.  His email address is
[log in to unmask]

John Guy
ACI / EMPF
714 N. Senate Ave.
Indianapolis, IN 46202-3112
voice:  (317) 655-EMPF ext.130
fax:    (317) 655-3699
e-mail:         [log in to unmask]

-----Original Message-----
From:   [log in to unmask]
[SMTP:[log in to unmask]]
Sent:   Friday, August 29, 1997 3:12 AM
To:     [log in to unmask]
Subject:        [TECHNET] Solder joint design

           Morning, or what is applicable.

Who knows about calculating forces and matters and FE-modelling in
solder joints? The case is ceramic chip capacitors 1pF and up. The work
has been done in PATRAN and the simulations tell that thermomechanical
forces are considerable. It is well known that certain forces can cause
local micro/macrocracks in the ceramic body, also that cracks can occur
in the solder joint etc. It's not an easy task, however, to interprete
and convert the results to the reality. One needs someone to discuss
with. Magnus, is the guy who performs the computer work . I'm not at my
office week 36, so mail to Magnus in case of experience in this matter.
/Ingemar & Magnus