Morning, or what is applicable.

Who knows about calculating forces and matters and FE-modelling in
solder joints? The case is ceramic chip capacitors 1pF and up. The work
has been done in PATRAN and the simulations tell that thermomechanical
forces are considerable. It is well known that certain forces can cause
local micro/macrocracks in the ceramic body, also that cracks can occur
in the solder joint etc. It's not an easy task, however, to interprete
and convert the results to the reality. One needs someone to discuss
with. Magnus, is the guy who performs the computer work . I'm not at my
office week 36, so mail to Magnus in case of experience in this matter.
/Ingemar & Magnus