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August 1997

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Subject:
reflow standards for leaded devices
From:
"Stephen L. Mead" <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Wed, 27 Aug 1997 11:41:06 -0400
Content-Type:
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I am presently trying to establish minimum acceptable quality standards
for leaded devices that are being soldered in my SMT reflow process.
Has anyone done this already?  I am thinking of applying the conditions
found in table 9-1 from J-STD-001A.  Is this a valid assumption or
should I try to develope a new standard?

Thanks in advance for your help

Stephen L. Mead Specialist I.E.
Alcatel Network Systems
2912 Wake Forest Rd
Raleigh NC 27609

email [log in to unmask]
phone (919)850-5585

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