Hi Technetters!

 I am presently looking for the original C4 process publication papers
(1963, from IBM Journal of Research and Development). Going thru. my univ.
might take some time before I get it, but I need it urgently. Has
anyone out there got a copy? Here are the authors/titles:

1: "Controlled Collapse Reflow Chip Joining" by F.L.Miller. Vol
13, pp239-250.
2: "Geometric Optimisation of Controlled Colapse Interconnections" by
L.S.Goldman. pp 251-269.
3: "SLT Device Metallurgy and its Monolithic Extension" By P.A.Totta
and R.P.Sopher. vol. 13, no.3, pp 226-238.
(PS Refs. 1-3 are from the IBM Journal cited above)

4: "Flip-Chip Interconnection Technology for Advanced Thermal
Conductive Modules", By S.K.Ray, K.Beckham + R. Master, from Proc.
1991 Electronic Components and Technology Conference, pp. 772-778.

Thank you.

Tennyson
Tennyson Nguty, AeroMech Department, Newton Building, Salford University
Manchester M5 4WT, UK. Tel: 0161-745 4696, Fax: 0161-745 5575