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August 1997

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Subject:
Re: Die Attach
From:
"Roback, Tim" <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Fri, 22 Aug 1997 13:09:00 -0600
Content-Type:
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The Electronic Materials Handbook, Volume 1, Published by ASM International,
copyright 1989  has a chapter dedicated to die attach methods,
advantages/disadvantages etc.  I've found this to be a very useful reference
book in general.

Tim Roback
Senior Supervisor,
Component Engineering
Allen-Bradley/Rockwell Automation
Milwaukee, WI
 ----------
From: Denis Meloche
To: tfroback; TechNet
Subject: [TECHNET] Die Attach

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