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August 1997

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Subject:
From:
Joel Mearig <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Tue, 19 Aug 1997 15:38:53 -0700
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I am looking for information regarding the susceptibility of TSOPs to
temperature exposure of the reflow process. Currently I have seen data that
shows a maximum temperature of the component body of 235 deg C for 10
seconds. I don't know why they use that number or what the failure
mechanism is if this data is not adhered to strictly. Thanks in advance for
your help.      Joel


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