Bill -
        Electrochemicals has done an extensive desmear and plating study of
AlliedSignals Resin Coated Copper products.  The RCC material being
desmeared was not Polyimide but in the same family and desmears
similiarly.  Let me know if you would like a copy of this study off
line.

Kevin R. Thomas
MicroVia Materials Manager
Ph :  608.791.2288
Fax :  608.791.2428
E-mail :  [log in to unmask]

 ----------
>>>From: Bill Chou
>>>To: [log in to unmask]
>>>Subject: [TECHNET] FAB- Post plasma Cleaning
>>>Date: Tuesday, August 19, 1997 2:17PM
>>>
>>>
>>>
>>>I need advice or suggestion on cleaning process after laser drill via.
>>>
>>>We use YAG (UV range, 355 nm) to drill microvia in flex material
>>>(Cu/polyimide/Cu).  The Cu thickness is 0.2 um+  and polyimide is 1-2 mil
>>>thick.  Can anyone share your experience about cleaning (wet, dry,...etc.)
>>>after laser drill and before metallization step (via fill)?  The criteria
>>>are
>>>(a) maintain the adhesion between original Cu and polyimide without
>>>delamination (b) good adhesion between etch via wall and metallization.
>>>
>>>Thank in advance.
>>>
>>>Bill Chou
>>>Fujitsu Computer Packaging Technologies
>>>(408) 943-7721
>>>Fax: (408)943-7790
>>>[log in to unmask]
>>>