Hello,

     Based on my literature research, my preliminary plans would be:

     1. Obtain SIR comb pattern coupons, run them through the assembly
     process w/o components. Use interested flux and solder wire, reflow.

     2. SIR test  OR

     1. Run the product board through the assembly process w/o components.
     Use interested flux and solder wire, reflow.

     2. Ionic test like Omagemeter

     Definitely, the second plan is simpler for us. But I am not sure it
     can work. Could someone provide some advices on a simple workable
     qualification procedure for no-clean rework?

     Another related question:

     I am aware of 2 options to make test coupons: one is to get coupons;
     the other is to get Gerber file of the test pattern and generate it on
     the product board. Which one is better?

     Appreciate any help.

     Regards,

     Yuan