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August 1997

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Subject:
Re: BGA DFM
From:
David Hoover <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Sat, 16 Aug 1997 06:27:15 -0700
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Seeing many BGA designs manufactured, there now
seems to be as many mask defined as there are pad
defined BGA footprints on PCB's. Is that because
the PBGA (laminate substrate vs. ceramic) are getting
to be so readily available? (CTE's are basically the same
to the PCB?)

The above comments are of my own opinion, and
not necessarily that of my employer.

http:\www.hadco.com:8080

Dave Hoover (aka, Groovy)
NPI Mgr HADCO TC2
Watsonville, CA

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Subject: [TECHNET] BGA DFM

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