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August 1997

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Subject:
From:
Don Vischulis <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Fri, 15 Aug 1997 20:19:52 -0500
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Cristian:

IPC and EPA have performed an extensive round robin test comparing the
reliability of direct metallization to electroless copper in their
design for the environment tests which have recently been published.
Contact IPC for available test reports.

Don Vischulis

Cristian Bomboe wrote:
>
> Hi,
>
> Does anybody installed a Direct Plating System in the PCB plant?
> I am interested into a comparison between low built electroless copper system and direct plating systems.
>
> Thanks,
> Cristian


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