Hello,

     I have recommended some BGA DFM to our board design engineers:

     Use of non-solder-mask-defined pads; solder-mask plug vias for wave
     soldering; Min space between a BGA and other components 0.200".

     Do you have any comments? What else need be added?

     Any restrictions on putting components on the opposite side of the BGA
     site? My opinion is NO.

     Appreciate any inputs.

     Regards,

     Yuan Li