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August 1997

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Subject:
From:
"Carroll, George (MIS, GEFanuc, NA)" <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Fri, 15 Aug 1997 16:32:08 -0400
Content-Type:
text/plain
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text/plain (33 lines)
The IPC / EPA "Implementing Cleaner Technologies in the Printed Wiring
Board Industry: Making Holes Conductive" publication compares several
direct metal technologies.  I would imagine the person to contact about
the availability of this is Star  Summerfield 847-509-9700  or
[log in to unmask]  My copy says the survey analysis is available at
http://es.inel.gov/dfe/p2_report/index.5html

        ----------
        From:   Windows/CristianB/CristianB on behalf of Cristian
Bomboe[SMTP:[log in to unmask]]
        Sent:   Friday, August 15, 1997 12:39 PM
        To:     'TechNet Mail Forum.'
        Subject:        RE: [TECHNET] SHADOW PROCESS

        I'm very interested too.
        Cristian

                ----------
                From:   Luis Hernandez[SMTP:[log in to unmask]]
                Sent:   Friday, August 15, 1997 1:32 AM
                To:     [log in to unmask]
                Subject:        [TECHNET] SHADOW PROCESS

                Colleagues,

                Does anybody has any information on Shadow process
acceptance in the PCB
                industry.
                I would like to know any pro. or cons. on this process.

                                                        Thank you.


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