TECHNET Archives

August 1997

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re: gold ball bonding
From:
Paul Stolar <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Fri, 15 Aug 1997 15:20:03 -0600
Content-Type:
text/plain
Parts/Attachments:
text/plain (12 lines) 
     It can be done, but not in a mfg environment. You are talking about
     cold welding. To do this, clean the 2 surfaces very well.Both must be
     very flat and polished. Press the 2 metal together and wait for
     diffusion bonding to take place. This is not applicable to the real
     world.


______________________________ Reply Separator _________________________________
Subject: [TECHNET] gold ball bonding
Author:  <[log in to unmask]> at internet

ATOM RSS1 RSS2