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August 1997

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Subject:
SMOBC
From:
annie laberge <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Fri, 15 Aug 1997 12:09:45 -0400
Content-Type:
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text/plain (13 lines) 
1. Regarding SMOBC, liquid photo, what would (in general) be the maximum
temperature and time a solder mask can hold before any deterioration occur
in a reflow oven?

2. Same question but for PCB built with  standard FR4 material, 6-8
layers...what is the MAXIMUM  temperature and time suggested in a reflow
oven for this type of PCB ?

Thank you in advance

ALaberge

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