TECHNET Archives

August 1997

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Re: Solder mask material
From:
[log in to unmask]
Reply To:
TechNet Mail Forum.
Date:
Thu, 14 Aug 1997 23:38:33 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (10 lines) 
It is unlikely that any LPI soldermask will survive such reflow conditions as
you describe when applied over tin/lead.  Possibly,  a thick (3mils) dryfilm
soldermask would have a better chance.  Is it possible to use soldermask over
bare copper, instead?

Mark Dowding
Regional Technical Specialist
Insulectro

ATOM RSS1 RSS2