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August 1997

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Subject:
Re[2]: [TECHNET] Solder mask material -Reply
From:
TOM BRESNAN <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Thu, 14 Aug 1997 17:42:41 PST
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text/plain
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     Another alternative, if you feel you need the reflowed solder, is to
     relieve the mask from the widest traces (over .050) to prevent the
     problem. There are some guidelines for this in IPC-D-275 (5.5.1) or
     its replacement document...


______________________________ Reply Separator _________________________________
Subject: Re: [TECHNET] Solder mask material -Reply
Author:  "TechNet Mail Forum." <[log in to unmask]>,          annie laberge
<[log in to unmask]> at INTERNET_GATEWAY

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