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August 1997

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Subject:
Re[2]: [TECHNET] Rework cooling rate
From:
MCHAN <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Wed, 13 Aug 1997 11:47:25 -0400
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text/plain
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text/plain (15 lines) 
Guenter,

I would agree with your statements, I have seen and read about these different
solder behaviors... can you comment on the crack initiation process, if stress
does not last long on a visco-plastic material... we can talk about this
off-line if you would like...

Marcelo
Harris Corp., FL
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Subject: Re: [TECHNET] Rework cooling rate
Author:  "TechNet Mail Forum." <[log in to unmask]> at smtp

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