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August 1997

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Subject:
Re: Re[2]: [TECHNET] Gold / Silver Incompatibility for Adhesives
From:
Jan Bokhove <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Mon, 11 Aug 1997 15:26:12 +0200
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*****  Unclassified  *****

>Dag Jan,
>
>I've been following the discussion on the PbSn/Ag, PbSn/Au interconnect
>with great interest.
>
>Have you got experience with glued Pd/Ag or Pd/Au interconnects?
>
>Thanks in advance,
>Luc.
>
>Luc Boschmans
>Alcatel Bell Research
>Francis Wellesplein 1
>B2018 Antwerpen Belgium
>
>tel: ++ 32 3 240 76 47
>fax: ++ 32 3 240 99 32
>e-mail: [log in to unmask]
>
>
--------------------------------------------------------------------------------
Hallo Luc,

Yes, we use both materials in combination with silver filled epoxy. If you have specific question about it, i suggest you contact me off-line. It is not my field of expertise, but i can direct you to one of my colleagues.

Jan Bokhove
Dep. CQM
Hollandse Signaalapparaten
tel. +31 74 2482949
e-mail [log in to unmask]

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