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August 1997

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Subject:
From:
Luc Boschmans <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Fri, 8 Aug 1997 17:54:13 +0200
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Dag Jan,

I've been following the discussion on the PbSn/Ag, PbSn/Au interconnect
with great interest.

Have you got experience with glued Pd/Ag or Pd/Au interconnects?

Thanks in advance,
Luc.

Luc Boschmans
Alcatel Bell Research
Francis Wellesplein 1
B2018 Antwerpen Belgium

tel: ++ 32 3 240 76 47
fax: ++ 32 3 240 99 32
e-mail: [log in to unmask]



> Subject: Re: [TECHNET] Gold / Silver Incompatibility for Adhesives
> Author:  "TechNet Mail Forum." <[log in to unmask]> at smtp
> Date:    8/7/97 9:24 AM
>
> >>> Sheila Smith <[log in to unmask]> 08/07/97 07:20am >>>
> Jan,
>
>  What sort of problems have you seen with Ag filled adhesives & PbSn
> solders??  We are experiencing a mystery anamoly after elevated temp
> burn-in
> and suspect the Ag filled epoxy is doing something unexpected ... could you
> elaborate?
>
>  Thanks, Sheila Smith, TRACOR AES
>
> At 11:10 AM 8/7/97 +0200, you wrote:
> >*****  Unclassified  *****
> >>
> >>I have been told that gold and silver are incompatible materials for
> >>bonding together, and that, therefore, gold finishes and silver-filled,
> >>electrically conductive adhesives will not work well together.  Does
> >>anyone have any data to corroborate or contradict this information?
> >>
> >>Steve Murphy
> >>
> >-------------------------------------------------------------------------------
> >
> >Steve,
> >
> >We have a very long experience with silver-filled, electrically conductive
> adhesives on gold. We use it, among others, for die bonding. We have never
> experienced problems due to incompatability between gold and silver. We
> have
> seen problems with both materials in combination with PbSn solders, maybe
> thats where this 'rumour' comes from.
> >Hope this helped.......
> >Jan Bokhove
> >Dep. CQM
> >Hollandse Signaalapparaten
> >tel. +31 74 2482949
> >e-mail [log in to unmask]
> >


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