TECHNET Archives

August 1997

TechNet@IPC.ORG

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Subject:
From:
Jim Douglas <[log in to unmask]>
Reply To:
TechNet Mail Forum.
Date:
Sat, 2 Aug 1997 12:02:41 +-100
Content-Type:
multipart/mixed
Parts/Attachments:
text/plain (466 bytes) , application/ms-tnef (1579 bytes)
Scott
This should automatically give you my E mail address.
Just in case it is:

[log in to unmask]

Rgds.

JimD

----------
From:   [log in to unmask][SMTP:[log in to unmask]]
Sent:   02 August 1997 00:49
To:     [log in to unmask]
Subject:        [TECHNET] Surface prep prior to solder mask

To Jim Douglas -

I am sorry Jim, but during downloading your file I lost your e-mail address.
If you could respond I'd like to talk with you on surface prep.

                             Thanks, Scott Kivi



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