Orna and Yehuda wrote:
> 
> Hi everyone,
> I just managed to dig through all the stuff on my desk and find the April issue of CircuiTree. Among the articles there was one about IST (=Interconnect Stress
> 
> My questions to you:
> - Does anybody have any experience with this test and is willing to share the knowledge ?
> - I understand that this method is supposed to allow a good distinction between PTH failures and interconnect failures (post separations), is that really so?.
> - Where can I find guidelines for designing a test method for IST?
> 
> Thanks,
> Yehuda
> 
>     *************************************
>     *          Yehuda E. Weisz
>     *  e-mail: [log in to unmask]
>     *  Tel: 972-3-5240362
>     ************************************


Yehuda,

1.  Besides Bill himself I know that both Randy Reed of Merix and Octavian Iordache 
of Circo Craft have experience with the test system.  Contact me off the Technet if 
you need contact information.

2.  Very preliminary information that we (IPC Post Separation TG and PTV Reliability 
TG) have indicates that it does.  Contact Lisa Williams of the IPC staff to obtain 
the Post Separation TG minutes from Expo ‘97.  These Task Groups are in the process 
of preparing a test plan that intends to verify this as well as correlate the results 
to the existing thermal stress (solder float) test.  This test plan will likely be 
the main topic of discussion at the upcoming IPCWorks meeting in Washington.

3.  I am personally working on a proposed IPC-TM-650 Test Method (2.6.26) that I can 
send to you if you wish.

Brian McCrory
Chairman, IPC Testing Committee


Delsen Testing Laboratories, Inc.
1024 Grand Central Ave.
Glendale,  CA  91201

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