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August 1997

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TechNet Mail Forum<[log in to unmask]>
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Date:
Sat, 16 Aug 1997 06:27:15 -0700
Reply-To:
"TechNet Mail Forum." <[log in to unmask]>, David Hoover <[log in to unmask]>
Subject:
Re: BGA DFM
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From:
David Hoover <[log in to unmask]>
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Seeing many BGA designs manufactured, there now
seems to be as many mask defined as there are pad
defined BGA footprints on PCB's. Is that because
the PBGA (laminate substrate vs. ceramic) are getting
to be so readily available? (CTE's are basically the same
to the PCB?)

The above comments are of my own opinion, and
not necessarily that of my employer.

http:\www.hadco.com:8080

Dave Hoover (aka, Groovy)
NPI Mgr HADCO TC2
Watsonville, CA

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Subject: [TECHNET] BGA DFM

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