TECHNET Archives

August 1997

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TechNet Mail Forum<[log in to unmask]>
Subject:
From:
Paul Gould <[log in to unmask]>
Date:
Fri, 15 Aug 1997 19:45:43 +0100
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1.0
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"TechNet Mail Forum." <[log in to unmask]>, Paul Gould <[log in to unmask]>
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We have a small surface mount pwb to assemble which is plated with 20-25
microns (0.8 - 1mil) of electroless nickel and are concerned about
solderability.
Does anyone have any experience of solder paste fusing to electroless
nickel without any gold coating? We use no clean so is there a suitable
paste which does not require cleaning?
Any help or advice would be greatly appreciated.
Paul Gould
[log in to unmask]
Isle of Wight,UK


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