Hi,
Can you elaborate on why you would use Ag filled epoxy in conjunction
with PbSn solder?? As for using Ag filled epoxy on Au surfaces, isn't
this technology main stream in die attach on MCM, COB applications
where the die is electrically grounded to the die pad via Ag filled
epoxy....We have not seen any reliability problems even on Mil type
applications
Marcelo
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Subject: Re: [TECHNET] Gold / Silver Incompatibility for Adhesives
Author: "TechNet Mail Forum." <[log in to unmask]> at smtp