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August 1997

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Subject:
Re[2]: [TECHNET] Gold / Silver Incompatibility for Adhesives
From:
MCHAN <[log in to unmask]>
Date:
Thu, 7 Aug 1997 11:16:08 -0400
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"TechNet Mail Forum." <[log in to unmask]>, MCHAN <[log in to unmask]>
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     Hi,

      Can you elaborate on why you would use Ag filled epoxy in conjunction
     with PbSn solder??  As for using Ag filled epoxy on Au surfaces, isn't
     this technology main stream in die attach on MCM, COB applications
     where the die is electrically grounded to the die pad via Ag filled
     epoxy....We have not seen any reliability problems even on Mil type
     applications

     Marcelo


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Subject: Re: [TECHNET] Gold / Silver Incompatibility for Adhesives
Author:  "TechNet Mail Forum." <[log in to unmask]> at smtp

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