I just completed a DoE for our new screen printer.  My board design included at
least one of each type component used on all (or most) of our assemblies.
These parts included a various sizes of chip components (down to 0402s), LCCs
(20 - 68 I/Os), QFPs (196 pin, 25 mil pitch), and BGAs (up to 625 balls).  The
criteria used to optimize the system was solder paste height, width and length.

If you have any additional questions, please don't hesitate to call.

Jim Marsico
(516) 595-5879
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