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August 1997

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Sun, 31 Aug 1997 14:27:58 +0800
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"TechNet Mail Forum." <[log in to unmask]>, tonghh <[log in to unmask]>
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    Hello Technetters :

    Recently nickel palladium was actively being discussed in the plating forum
    as an alternative replacement for HAL processes or Ag plate .A lots of
    advantages have been mentioned .What is its disadvantages if any .Can
someone
    enlighten on this aspect .Thanks .


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