TECHNET Archives

August 1997

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
TechNet Mail Forum<[log in to unmask]>
Subject:
TSOP susceptibility to temperature
From:
Joel Mearig <[log in to unmask]>
Date:
Tue, 19 Aug 1997 15:38:53 -0700
Reply-To:
"TechNet Mail Forum." <[log in to unmask]>, Joel Mearig <[log in to unmask]>
Parts/Attachments:
text/plain (8 lines) 
I am looking for information regarding the susceptibility of TSOPs to
temperature exposure of the reflow process. Currently I have seen data that
shows a maximum temperature of the component body of 235 deg C for 10
seconds. I don't know why they use that number or what the failure
mechanism is if this data is not adhered to strictly. Thanks in advance for
your help.      Joel

ATOM RSS1 RSS2