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August 1997

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TechNet Mail Forum<[log in to unmask]>
Subject:
gold ball bonding
From:
[log in to unmask]
Date:
Fri, 15 Aug 1997 13:54:52 -0400
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"[log in to unmask]"@shrdns.tdh.qntm.com
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"TechNet Mail Forum." <[log in to unmask]>, [log in to unmask]
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Hello Everybody,

I had a couple questions concerning gold ball bonding.  First I was wondering
about the feasability of gold ball bonding without using heat.  Second, What
is the finist tip on a capillary that can be made for a deep access application
The diameter can not be greater than 9.5 mils at 50 mils up from the tip. If
such a cap is possible to make what diameter wire would be used.

Thanks for the help,
Peter Scott

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