TECHNET Archives

August 1997

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TechNet Mail Forum<[log in to unmask]>
Subject:
From:
"MIKE J. LOPEZ" <[log in to unmask]>
Date:
Wed, 13 Aug 1997 07:29:34 -0400
Reply-To:
"TechNet Mail Forum." <[log in to unmask]>, "MIKE J. LOPEZ" <[log in to unmask]>
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Unless your board fabricator put an unusual amount of solder during
there hasl process I cant see how just applying flux can give you a
reliable solder joint. This is certainly not the norm. Normally you apply
solder paste that has flux in it, place the parts and then reflow. And you
said there were cold solder joints on the sockets. Was that the sockets
only. If it was the sockets only then your cold solder joints were
probobly due to something else like maybe reflow temperature or board
handling after reflow.
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