DESIGNERCOUNCIL Archives

August 1997

DesignerCouncil@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
DesignerCouncil <[log in to unmask]>
X-To:
Jeff McGlaughlin <[log in to unmask]>
Date:
Tue, 12 Aug 1997 09:33:57 -0700
Reply-To:
"DesignerCouncil Mail Forum." <[log in to unmask]>, Jack Olson <[log in to unmask]>
Subject:
Re: DES:Thermal Concern for SMT Board?
MIME-Version:
1.0
Content-Transfer-Encoding:
7bit
Content-Type:
text/plain; charset=us-ascii
From:
Jack Olson <[log in to unmask]>
Parts/Attachments:
text/plain (15 lines) 
Jeff McGlaughlin wrote:
> --Help!-- I am working on a design for an active antenna
> mounted external to jet aircraft. I am concerned about the
> CTE mismatch between ceramic and plastic components
> (including 2 16-pin SOICs)  and  FR-4 laminate. Can anyone
> suggest materials/vendors for this type of application?

WOW! Sounds like its going to be severe thermal cycling.
You are likely faced with some significant shock and
vibration issues, too!
I hate to sound "low tech", but can you go back to using
through-hole components?

Sorry I can't be more helpful,                      Jack

ATOM RSS1 RSS2