This is a repost of a question I posted several weeks ago. I have yet to receive
a single response! Now I see a similar question (see below) posted by Thomas
Lepsche... C'mon technetters, someone out there must be doing this stuff! Or,
can anyone suggest a better discussion venue for this?
Still hoping for some response.... please???
Thanks,
V. Chapman
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I am currently investigating various types of non-contact process monitoring for
solder joint inspection. This includes Xray laminography, transmission Xray, and
various types of automated optical inspection.
If you have purchased or investigated any of this type of equipment, I am
interested in any words of wisdom,comments, experiences, etc. that you're
willing to share with me. More specifically, my questions are:
1. Various AOI vendors use different light sources, from programmable banks of
LED's(Control Automation, Theta Group), to 3-color incandescent lighting
(Omron), to infrared (MVP). Any ideas on pro's and con's of these different
schemes?
2. In the real world, how good are these machines at recognizing good vs. bad
solder joints? (I already know what the vendors say!)
3. How much programming support is needed? (expressed in # of engineers, # of
techs, etc.)
4. If you have purchased any of this equipment, how did you cost-justify it? Are
you using it in-line or off-line? At what point in your process? Has it proven
cost-effective?
5. If we're only doing a very small amount of BGA, is the extra $$$ to go with
Xray laminography really worth it?
6. Is anyone using automated inspection with human (rather than machine) defect
recognition?
Thanks!
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On Thu, 10 Jul 1997 14:49:54 -0700 Lepsche, Thomas G (NM75) wrote:
> From: Lepsche, Thomas G (NM75) <[log in to unmask]>
> Date: Thu, 10 Jul 1997 14:49:54 -0700
> Subject: Test Strategy
> To: "[log in to unmask]" <[log in to unmask]>,
> "[log in to unmask]" <[log in to unmask]>
>
>
> A major change in test strategy has been propose for our factory and I
> am looking for comments addressing pro's and con's. The strategy has
> surfaced due to the increased density of late 90's design density and
> availability of the higher density, lower inspectable, higher test cost
> components and assembly strategies.(BGA's, COB, Chipscale, etc.)
> The major change is to put a full function x-ray capability (x-ray
> Laminography) in front of an in-circuit tester to verify 100 % solder
> joint integrity, orientation of part placement, presence of part,
> configuration right part, Etc. This will assure that solder integrity
> and placement are 100% and greatly reduce defects found down stream at
> final LRU acceptance or Burn-In.
>
> We are: High Mix
> Low Volume
> Moderate to High Complexity
> 60% Thru Hole, 30% SMT, 10% Mixed Technology
>
>
> Thanks for your time invested in response
> Semper Fi
> Tom
>
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