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July 1997

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Subject:
Electroless Nickle and Immersion Gold
From:
[log in to unmask] (Sam Pirayesh)
Date:
Thu, 10 Jul 1997 07:41:14 -0700
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Hi All,
Recently I heard of Solderability issue and lead fracture on fine picth QFP (16 mils or 
less) during vabiration test on the PWB with Electroless Nickle and Immersion 
Gold finish (100u-200u of Nickle and 3u-5u of gold) , couple reason was mention one 
being the flux used during the assembly and another was the Nickle passivation on the 
PWB before assembly. 
Is any of you have any experience with this problem and if you do, what you have done to 
correct the problem. Also I am interested on all the good things you can tell me about 
this finish type.
Thanks.

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