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July 1997

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Subject:
From:
Phil Bavaro <[log in to unmask]>
Date:
Wed, 9 Jul 1997 17:54:35 -0800
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Almost any of the benchtop flowing solderbath systems on the market will
work.  Hakko, air-vac, etc.   Just look for ones which have nozzles
designed for the removal of PGA's.

We have used a Hakko system which has interchangeable nozzles for years.
It is ideal for PGA's because it centers the board over the nozzle with a
light beam and it has an analog timer which can be programmed to indicate
when to extract the component.

One word of caution......don't pull the PGA out until you are sure that all
of the connections have melted.  I have seen operators pull the barrels
right out of the boards still attached to the component.

Hope this helps.




At 4:13 PM -0800 7/9/97, Tom Hybiske wrote:
>Does anyone know of a commercially available tool for de-soldering
>PGA's, specifcally 144 PGA's from assembled printed wiring boards?
>
>Thanks,
>Tom Hybiske
>General Atronics Corp.
>
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Phillip A. Bavaro

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