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Date: | Wed, 09 Jul 1997 16:37:28 -0700 |
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Did BGA (PWB?) substrate warp, causing the non-contacts?
Did the motherboard PWB that the BGA is reflowed to warp?
-Michael Alderete
Aerojet
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From: rob starr[SMTP:[log in to unmask]]
Sent: Wednesday, July 09, 1997 4:13 PM
To: ipc
Subject: BGA Question
Hello there, an engineer friend of mine suggested asking this question to
this address for advise.
I have some separation of BGA contact from PCBs, the pad size is 20 mil,
the balls are 30 mil, the pitch is 50 mils. the board is Fr-4 , 0.062 ".
4
layer
is this configuration acceptable or what changes to the pad could be made
to improve solderability?
thanks in advance,
[log in to unmask]
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Subject: BGA Question
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