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July 1997

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Subject:
From:
"Larry Crane" <[log in to unmask]>
Reply To:
Date:
Wed, 9 Jul 1997 13:03:18 -0400
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In formulating solder masks I found that both the ionic contamination level
as well as minor improvement in pencil hardness is found.  The UV bump can
be either before or after the thermal step.  There are advantages to ethier
place.

----------
> From: [log in to unmask]
> To: [log in to unmask]
> Subject: U.V. cure of L.P.I. soldermasks
> Date: Wednesday, July 09, 1997 10:51 AM
> 
> 
> 
> 
> 
> 
> 
>      I have a question in regard to the curing of L.P.I.
> soldermasks.  Many people cure their screened boards thermally only,
> with no U.V. "bump".  Other people insist that the additional U.V.
> cure is needed to make the mask stronger 'pencil strength scale".
> Some people claim that the amount of hardness that the U.V. cure adds
> is so insignifigant to a properly thermally cured board, that it is a
> waste of valuable time to perform this operation.  I am looking for
> some input on what other people have found in regard to this issue and
> would greatly appreciate any feedback that I can get.  Thank you.
> 
>
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